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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Rogers 4350 Material PCB For RF / Microwave PCB , RO4350 High Frequency PCB

Shenzhen Xinchenger Electronic Co.,Ltd

Rogers 4350 Material PCB For RF / Microwave PCB , RO4350 High Frequency PCB

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Brand Name : XCE

Model Number : XCER

Certification : ISO9001/TS16949/IPC/ROHS/UL

Place of Origin : China

MOQ : 1piece

Price : USD 10-100 Pieces

Payment Terms : T/T, Western Union, L/C

Supply Ability : 10000000Piece/Pieces per Month

Delivery Time : 5-8 work days

Packaging Details : inner:vacuum-packed bubble bag outer: carton box

Base Material : Rogers 4350B pcb

Number of Layers : 4-Layer

Copper Thickness : 1oz

Board Thickness : Mechanical drill: 8mil(0.2mm)

Surface Finishing : HASL/HASL lead free/immersion gold/ENIG

Min. Line Width : 0.075mm(3mil)

Min. Line Spacing : 0.1mm(4mil)

Min. Hole Size : 0.1mm(4mil)

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Some Typical Applications:
• Automotive radar applications
• Global positioning satellite
antennas
• Cellular telecommunications
systems - power amplifi ers and
antennas
• Patch antenna for wireless
communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers

Rogers 4350B laminate in stock

  • 2 layer rogers pcb laminate
  • Green solder mask,
  • Model:XCER
  • Copper THK: 1OZ
  • Location: Shenzhen

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

Capability Standard Advanced
Laminate materials FR4 / FR1 / CEM-3 / CEM-1 / Aluminum / Flex-rigid /Teflon / High-TG / Rogers / Taconic
Surface Finish

HASL (vertical & Horizontal), Lead Free HASL,

HASL+Gold Finger,

OSP/Entek,

ENIG, ENEPIG,

Immersion Tin(ISn) ,Immersion Silver(IAg),

Carbon Ink,

Hard Gold(Flash Gold), Soft Gold

Min. Thickness for inner layers 0.020"-0.125" 0.003”(0.07mm)
Board layers 1-12 Layers 1-24 Layers
Board Thickness 0.5mm-3mm 0.2mm-7mm
Copper weight 0.5 oz – 3 oz 0.5 oz – 8 oz
Minimum Trace Width / Spacing 0.004"/0.004" 0.003"/0.003"
Solder Mask Color

Green,Blue,Black,Red,Yellow,White, and customized

Drill deviation 0.008" ±0.002” (0.05mm)
PTH hole tolerance 0.008" ±0.002” (0.005mm)
PTH hole tolerance 0.008" ±0.002” (0.005mm)
Min hole size 0.010" 0.008” (0.02mm)
E-test Flying Probe Tester/Test-Jig/X-ray/ICT/AOI/FCT
Controlled Tolerance ± 5% ± 3%
Silkscreen Color White, Black, Yellow, Green, Red, Blue and customized
Min solder mask clearance size 0.008 0.003” (0.07mm)
Min silkscreen clearance size 0.010" 0.006” (0.15mm)
IPC Class Class 2 Class 3
Blind Vias YES YES
Buried Vias YES YES
Aspect Ratio 8/1 15/1
Carbon Ink YES YES
Peelable Mask YES YES
Solder Sample YES YES
First Article YES YES
Certificate UL / SGS / ROH / ISO / TS16949 / ISO14001:2004
Acceptable file format GERBER file, PROTEL 99/PADS / POWER PCB / AutoCAD /EGLE

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.For many applications, it is sufficient to use Rogers material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital


Advantage

1. PCB factory directly

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


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