Brand Name : XCE
Model Number : XCE Bh788
Certification : CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : MOQ 1 Piece
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 1000000 pieces per week
Delivery Time : 5-10 working days
Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color : Green
Material : FR4
Layer : 4
Board Size : 7*6cm
Copper Thinknes : 1 oz
Min Line Width : 4 mil
Min Line Space : 4mil
Surface Finish : Immersion Tin
Name : FR4 PCB
RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask
Quick Detail :
1. Type : Pcb
2. Material : FR4
3. Layer : Multilayer
4. Products Size: 7*6cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,Cooper Base,high frequency material,Rogers,Taconic,Isola,F4B,Arlon
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
Data :
Layer | 1 to 28 layers |
Material type | FR-4,Rogers,Taconic,Isola,F4B |
Board thickness | 0.21mm to 7.0mm |
Copper thickness | 0.5 OZ to 7.0 OZ |
Copper thickness in hole | >25.0 um (>1mil) |
Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
Min. Drilled Hole Size: 3mil (0.075mm) | |
Min. Line Width: 3mil (0.075mm) | |
Min. Line Spacing: 3mil (0.075mm) | |
Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
Tolerance
|
Shape tolerance: ±0.13 |
Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
Production Description :
|
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Total Pad Size | Standard | Advanced |
Capture Pad | Drill + 0.008 | Drill + 0.006 |
Landing Pad | Drill + 0.008 | Drill + 0.006 |
BC Mechanical Drill (Type III) | 0.008 | 0.006 |
Laser Drill Size | 0.004-0.010 | 0.0025 |
Material Thickness | 0.0035 | 0.0025 |
Stacked Via | Yes | Yes |
Type I Capabilities single & Double Deep | Yes | Yes |
Type II Capabilities Buried Vias with Microvias | Yes | Yes |
Type III Capabilities | Yes | Yes |
Copper Filled Microvia | Yes | Yes |
Smallest Copper Filled Microvia | 0.004 | 0.0025 |
Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | c |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask Images |