Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : FR4
Layer : 4
Color : Green
Min line space : 4mil
Min line width : 4mil
Copper thickness : 1OZ
Board size : 86*86mm
Panel : 1
Surface : ENIG
Immersion TIN FR4 2L Electronic Circuit Design
Quick detail:
Origin:China | Special: FR4 Material |
Layer:4 | Thickness:1.6mm |
Surface: ENIG | Hole:0.5 |
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Surface Finishes - Providing every surface finish you require.
White-Tin
Immersion Silver
Electroless Nickel - Immersion Gold (ENIG)
SMOBC (Soldermask Over Bare Copper)
HASL (Hot Air Solder Level) 60/40 Tin/Lead
HAL (Hot Air Solder Level) Lead-Free
Nickel - Palladium - Gold (Ni/Pd/Au)
Deep Nickel - Gold (Hard)
OSP (Organic Solderbility Preservative)
Selective Gold with SMOBC/HASL
Selective Gold with Immersion Finishes
Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.
2. Well-trained and experienced staffs to answer all your enquires in fluent English
3. OEM&ODM, we can help you to design and put into product.
4. Distributorship are offered for your unique design and some our current models
5. Protection of your sales area, ideas of design and all your private information
Trade Terms:
1. Payment: T/T in advance (Western Union , PayPal is welcomed)
2. Sample can be delivered in 3 days
3. Shipping freight are quoted under your requests
4. Shipping port: Shen zhen,Mainland China
5. Discounts are offered based on order quantities
6. MOQ: 1PCS
Technology Capability
1. No of layer
2-18 layer rigid PCB and High frequency PCB
2. Material
FR-4, high frequency,etc
3. Special technology
Buried/blind via, impedance control, thick copper,high frequency, metal core, gold fingers, peelable mask, countersink hole, hole plug, etc
4. Surface finishing
HASL, immersion gold, immersion silver, immersion tin, OSP, ENEPIG
5. Product application
Telecommunications, industrial electronics, automotive, medical, Power supply, LED lighting, aerospace, etc
Immersion TIN FR4 2L Electronic Circuit Design fr4 circuit board Images |