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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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4 Layer Rogers Mixed FR4 Wifi Antenna pcb boards With 5.8 GHz 3 Oz Copper Through Hole Via

Shenzhen Xinchenger Electronic Co.,Ltd

4 Layer Rogers Mixed FR4 Wifi Antenna pcb boards With 5.8 GHz 3 Oz Copper Through Hole Via

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Brand Name : XCE

Model Number : XCE B3

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Green

Material : Rogers Mixed FR4 Material

Layer : 4

Board Size : 48*48cm

Copper Thinknes : 3 oz

Min Line Width : 4 mil

Min Line Space : 4mil

Surface Finish : Immersion Gold

Name : Rogers pcb

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4 Layer Rogers Mixed FR4 Wifi Antenna pcb boards With 5.8 GHz 3 Oz Copper Through Hole Via

Products Details

Raw MaterialRogers
Layer CountMultilayer
Board Thickness0.8mm
Copper Thickness3.0oz
Surface FinishTin
Solder MaskBlack
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement480×480mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE


Parameter:


Rogers 4003 C Pcb With 3.38 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 4350 B pcb With 3.5 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 5880 Pcb With 2.2 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .





PrePreg Material

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s
LW Acoustic impedance6.64 MRayl






Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

































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