HF Rogers 4350 Mix Stack up Multilayer PCB Board / FR4 8 Layers PCB
Material: Rogers 4350B 0.254MM 0.508MM
PP material Rogers 4450
Core: 3 or 4
Stack up files: Necessary
|PCB Type:||Rogers PCB|
|Layer :||8 layer|
|Min .Line Width/Space:||5mil/5mil|
|Min. Via Diameter:||0.3mm|
|Material:||Rogers 4350B ro4350|
High-frequency circuit board processing special features:
1, The impedance control requirements more stringent, the relative
linewidth control is very strict, around two percent general
2, Due to the special substrate, the adhesion of electroless copper
PTH when not high, usually by means of plasma processing equipment
for the first through-hole and surface roughened to increase the
PTH copper and solder resist ink adhesion.
3, Before the solder can not do the grinding plate, or adhesion
will be poor, only with medicine and other micro-erosion roughened.
4, Most of material are polytetrafluoroethylene,will have many
burrs if use common cuts, need use specialized cuts.
5, High-frequency circuit board is a special high frequency
electromagnetic circuit board, generally defined as the frequency
of the high frequency of 1GHz. Its physical properties, precision,
technical parameters required is very high, commonly used in
automotive anti-collision systems, satellite systems, radio
Our products are widely used in high-tech communications, power,
instrumentation, computer networks, digital products, industrial
control, scientific, educational, medical, aerospace and defense.
Main material: rogers laminate
HF Rogers 4350 8 Layers PCB boards
A dielectric material is a substance that is a poor conductor of
electricity, and used as an insulating layer in the PCB build up.
Porcelain, mica, glass, plastics and some metal oxides are good
dielectrics. The lower the dielectric loss, (the proportion of
energy lost as heat) the more effective the dielectric material. If
the voltage across a dielectric material becomes too great -- that
is, if the electrostatic field becomes too intense -- the material
will suddenly begin to conduct current. This phenomenon is called
Our high density circuit boards have the technology pushing
capabilities to drive applications in a large number of industries
including but not limited to semiconductor test equipment, defense,
medical and aerospace.
RO4000 material’s thermal coeffi cient of expansion (CTE) provides
several key benefi ts to the circuit designer. The expansion coeffi
cient of RO4000 material is similar to that of copper which allows
the material to exhibit excellent dimensional stability, a property
needed for mixed dielectric multilayer boards constructions. The
low Z-axis CTE of RO4000 laminates provides reliable plated
through-hole quality, even in severe thermal shock applications.
RO4000 series material has a Tg of >280°C (536°F) so its
expansion characteristics remain stable over the entire range of
circuit processing temperatures. RO4000 series laminates can easily
be fabricated into printed circuit boards using standard FR4
circuit board processing techniques. Unlike PTFE based high
performance materials, RO4000 series laminates do not require
specialized via preparation processes such as sodium etch. This
material is a rigid, thermoset laminate that is capable of being
processed by automated handling systems and scrubbing equipment
used for copper surface preparation.