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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards

Shenzhen Xinchenger Electronic Co.,Ltd

HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards

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Brand Name : XCE

Model Number : XCEH

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Rogers Multilayer pcb

Brand : XCE

Origin : China

Copper THK : 1OZ

Name : Multilayer pcb printed circuit boards

Line width : 3mil

Line space : 3mil

Application : High frequency rogers pcb field

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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards

Advantage

Multilayer rogers pcb printed circuit board

1.Sufficient high frequency material raw

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours.

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

Multilayer pcb circuit boards :4Layer -36 layer

We can supply:

Rogers High Frequency Laminate/Material

High frequency pcb manufacture

PCB assembly

Specification:

Layer: 10

Color: black

Line width: 3mil

Line space: 3mil

Hole: 0.15MM

Multilayer pcb

Rogers Multilayer pcb Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Product Tags:

multi layered pcb

      

multilayer pcb fabrication

      
Wholesale HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards from china suppliers

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