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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-26055813
Contact Person:
Ms kico

RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

Brand Name : XCE
Model Number : XCE WTO
Certification : CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : MOQ 1 Piece
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 1000000 pieces per week
Delivery Time : 5-10 working days
Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color : Green
Material : Rogers Material
Layer : 6 L
Board Size : 19*18cm
Copper Thinknes : 1 oz
Min Line Width : 4 mil
Min Line Space : 4mil
Surface Finish : Gold Neckle Finger Plating
Name : Rogers pcb
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RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

Products Details

Raw MaterialRogers
Layer Count6
Board Thickness0.5 mm
Copper Thickness0.5 oz
Surface FinishGold Nickel Finger Plating
Solder MaskBlue
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement560*400mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PCB Capability


Layer1-30L
MaterialCEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness0.2-6mm
Max Finish Size800*508mm
Min. Drill Hole Size0.25mm
Min. Line Width0.075mm(3mil)
Min. Line Spacing0.075mm(3mil)
Surface finishHAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness0.5-4.0 Oz
Solder mask colorgreen/black/white/red/blue/yellow
Inner packingVacuum packing, Plastic Bag
Outer packingstandard carton packing
Hole tolerancePTH:±0.076,NTPH:±0.05
CertificateISO9001,SGS
Profiling punchingRouting,V-CUT,Beveling

Parameter:


Rogers 4003 C Pcb With 3.38 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 4350 B pcb With 3.5 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 5880 Pcb With 2.2 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz,2 oz, 3 oz

Rogers 3003 Pcb With 3 ER . There are 0.127mm,0.508mm 0.762mm 1.6 mm 3 mm Board Thinckness with 1 oz ,2 oz , 3 oz .

Rogers 3010 Pcb With 10.2 ER . There are 0.635 mm Thinckness Board with 1 oz , 2 oz ,3 oz .



PrePreg Material

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s
LW Acoustic impedance6.64 MRayl






Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.


Product Tags:

multi layered pcb

      

multilayer pcb manufacturing

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway Images

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