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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

Shenzhen Xinchenger Electronic Co.,Ltd

FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Min line space : 3mil

Min line width : 3mil

Copper thickness : 1OZ

Size : 8*4cm

Board THK : 1.0MM

Panel : 2*1

Surface finish : immersion gold

Model : XCEM

Brand : XCE

Material raw : Rogers

Color : Green

Layer : 1

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FR4 PCB Multilayer Boards ENIG High Frequency High Level Bonding Material

Quotation Requirement :

Following specifications are needed for quotation:

a) Base material

b) Board thickness

c) Copper thickness

d) Surface treatment

e) color of solder mask and silkscreen

f) Quantity

Parameter:

Max panel size 508*610mm
Board thickness tolerance T0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp 0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 28820Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Delivery Time for PCB board:

1) PCB production time: sample: 3-4 days / mass production: within 7 days

2) Component purchase: 2 days if all components is available in our domestic market.

3) PCB Assembly: samples: whthin 2 days / mass production: within 5 days

Shipping Method and Payment terms:

1. By DHL, UPS, FedEx, TNT using clients account.

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.

3. By EMS (Usually for Russia Clients), price is high.

4. By sea for mass quantity according to customer's requirement.

5. By customer's Forwarder

6.By Paypal,T/T,West Union,etc.

Testing Procedures For PCB Board:

We perform multiple quality assuring procedures before shipping out any PCB board.

These include:

* Visual Inspection

* Flying probe

* Impedance control

* Solder-ability detection

* Digital metallograghic microscope

* AOI (Automated Optical Inspection)

FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material


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Wholesale FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material from china suppliers

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