Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Min line space : 3mil
Min line width : 3mil
Copper thickness : 1OZ
Size : 8*4cm
Board THK : 1.0MM
Panel : 2*1
Surface finish : immersion gold
Model : XCEM
Brand : XCE
Material raw : Rogers
Color : Green
Layer : 1
FR4 PCB Multilayer Boards ENIG High Frequency High Level Bonding Material
Quotation Requirement :
a) Base material
b) Board thickness
c) Copper thickness
d) Surface treatment
e) color of solder mask and silkscreen
f) Quantity
Parameter:
Max panel size | 508*610mm | |
Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
Wall hole copper thickness | >0.025mm(1mil) | |
Finished hole | 0.2mm-6.3mm | |
Min line width | 4mil/4mil(0.1/0.1mm) | |
Min bonding pad space | 0.1mm(4mil) | |
PTH aperture tolerance | ±0.075mm(3mil) | |
NPTH aperture tolerance | ±0.05mm(2mil) | |
Hole site deviation | ±0.05mm(2mil) | |
Profile tolerance | ±0.10mm(4mil) | |
Board bend&warp | ≤0.7% | |
Insulation resistance | >1012Ωnormal | |
Through-hole resistance | <300Ωnormal | |
Electric strength | >1.3kv/mm | |
Current breakdown | 10A | |
Peel strength | 1.4N/mm | |
Soldmask regidity | >6H | |
Thermal stress | 288℃20Sec | |
Testing voltage | 50-300V | |
Min buried blind via | 0.2mm(8mil) | |
Outer copper thickness | 1oz-5oz | |
Inner cooper thickness | 1/2 oz-4oz | |
Aspect ratio | 8:1 | |
SMT min green oil width | 0.08mm | |
Min green oil open window | 0.05mm | |
Insulation layer thickless | 0.075mm-5mm | |
Taphole aperture | 0.2mm-0.6mm | |
Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Delivery Time for PCB board:
1) PCB production time: sample: 3-4 days / mass production: within 7 days
2) Component purchase: 2 days if all components is available in our domestic market.
3) PCB Assembly: samples: whthin 2 days / mass production: within 5 days
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6.By Paypal,T/T,West Union,etc.
Testing Procedures For PCB Board:
We perform multiple quality assuring procedures before shipping out any PCB board.
These include:
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material Images |